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CSD17579Q3A 데이터시트(PDF) 9 Page - Texas Instruments |
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CSD17579Q3A 데이터시트(HTML) 9 Page - Texas Instruments |
9 / 13 page (3.1) 4X 0.705 4X 1.125 (R ) TYP 0.05 8X (0.6) 8X (0.3) 6X (0.65) (0.208) (0.905) (0.663) (1.325) SYMM SOLDER MASK EDGE PKG 1 4 5 8 9 METAL TYP 4X (0.6) 4X (0.3) (1.775) (2.45) 0.05 MIN ALL SIDES 3X (0.65) 3X (0.65) (0.207) (0.975) TYP (R ) TYP 0.05 (0.245) (0.905) TYP (R ) TYP 0.05 (1.55) (0.56) (0.635) TYP ( ) VIA TYP 0.2 4X (0.3) LAND PATTERN EXAMPLE SYMM SOLDER MASK OPENING METAL UNDER SOLDER MASK 1 4 5 8 9 PKG CSD17579Q3A www.ti.com SLPS527A – SEPTEMBER 2014 – REVISED JANUARY 2016 7.2 Q3A Recommended PCB Pattern 1. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB Attachment application report, SLUA271. 2. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown. For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques. 7.3 Q3A Recommended Stencil Pattern 1. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. Copyright © 2014–2016, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: CSD17579Q3A |
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