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LM3444 데이터시트(PDF) 4 Page - Texas Instruments

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부품명 LM3444
상세설명  AC-DC Offline LED Driver
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
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LM3444 데이터시트(HTML) 4 Page - Texas Instruments

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LM3444
SNVS682D – NOVEMBER 2010 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VCC and GATE to GND
–0.3
14
V
ISNS to GND
–0.3
2.5
V
FILTER and COFF to GND
–0.3
7
V
COFF input current
60
mA
Continuous power dissipation(3)
Internally limited
TJ
Junction temperature
150
°C
Maximum lead temperature (soldering)
260
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typical) and
disengages at TJ = 145°C (typical).
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±1250
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
VCC
8
13
V
TJ
Junction temperature
–40
125
°C
6.4 Thermal Information
LM3444
THERMAL METRIC(1)
DGS (VSSOP)
D (SOIC)
UNIT
10 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
163.8
111.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
58.4
58.0
°C/W
RθJB
Junction-to-board thermal resistance
83.6
51.1
°C/W
ψJT
Junction-to-top characterization parameter
6.1
11.9
°C/W
ψJB
Junction-to-board characterization parameter
82.3
51.0
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2010–2015, Texas Instruments Incorporated
Product Folder Links: LM3444


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