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LM3444 데이터시트(PDF) 4 Page - Texas Instruments |
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4 / 27 page LM3444 SNVS682D – NOVEMBER 2010 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VCC and GATE to GND –0.3 14 V ISNS to GND –0.3 2.5 V FILTER and COFF to GND –0.3 7 V COFF input current 60 mA Continuous power dissipation(3) Internally limited TJ Junction temperature 150 °C Maximum lead temperature (soldering) 260 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 165°C (typical) and disengages at TJ = 145°C (typical). 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1250 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN MAX UNIT VCC 8 13 V TJ Junction temperature –40 125 °C 6.4 Thermal Information LM3444 THERMAL METRIC(1) DGS (VSSOP) D (SOIC) UNIT 10 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 163.8 111.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58.4 58.0 °C/W RθJB Junction-to-board thermal resistance 83.6 51.1 °C/W ψJT Junction-to-top characterization parameter 6.1 11.9 °C/W ψJB Junction-to-board characterization parameter 82.3 51.0 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: LM3444 |
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