전자부품 데이터시트 검색엔진 |
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M02139-23 데이터시트(PDF) 2 Page - M/A-COM Technology Solutions, Inc. |
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M02139-23 데이터시트(HTML) 2 Page - M/A-COM Technology Solutions, Inc. |
2 / 18 page 02139-DSH-001-D Mindspeed Technologies ® 2 Mindspeed Proprietary and Confidential Typical Eye Diagram Pad Configuration Ordering Information Part Number Package Operating Temperature M02139-13 Waffle Pack –40 °C to 95 °C M02139-23 Sawn Quartered Wafer –40 °C to 95 °C M02139-33 Expanded whole wafer on a ring –40 °C to 95 °C Revision History Revision Level Date Description D Release August 2011 Added 10G specifications. Added final specifications. C Preliminary March 2011 Removed 10G support and added lower data rate sensitivity performance. Revised ordering information details. B Preliminary August 2010 Corrected Figure 3-2 and other text edits. A Preliminary April 2010 Initial release. 10.3 Gbps, -15 dBm, 20 mV/div, 16 ps/div MON PINA PINK VCC AGC DOUT GND GND 1 2 3 4 56 7 13 14 VCC DOUT NC 9 8 10 12 11 NC Die size ≈ 1242 x 932 µm |
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