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TS3A227EYFFR 데이터시트(PDF) 3 Page - Texas Instruments |
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TS3A227EYFFR 데이터시트(HTML) 3 Page - Texas Instruments |
3 / 59 page GND GND SDA VDD GNDA RING2 SLEEVE SCL THERMALPAD 16 15 14 13 5 6 7 8 1 2 3 4 12 11 10 9 4 3 2 1 D C B A VDD SLEEVE_ SENSE GND INT SDA SCL GND TIP RING2 MICP RING2_ SENSE MIC_ PRESENT GND_ SENSE DET_ TRIGGER SLEEVE GNDA TS3A227E www.ti.com SCDS358B – NOVEMBER 2014 – REVISED FEBRUARY 2015 6 Pin Configuration and Functions DSBGA – YFF QFN – RVA Top View Top View Pin Functions PIN TYPE DESCRIPTION NAME RVA YFF A falling edge from high to low on this pin triggers accessory detection. This pin can be connected the DET_TRIGGER 15 B1 I/O headset jack to allow automatic pull-down to ground after headset insertion to initialize detection. GND 1, 2 A2, B2 GND Primary ground connection for the TS3A227E. Must be connected to system ground. Ground connection for the internal ground FETs of the TS3A227E. If FM is being supported connect this pin GNDA 11 D2 I/O to the FM matching network. If FM is not being support connect this pin to system ground. GND_SENSE 5 A4 I/O Ground sense line for the codec. Open drain interrupt output from the TS3A227E to notify the host that an event has occurred. If I2C is not INT 13 C2 GND used this pin must be grounded. MIC_PRESENT 16 A1 I/O Open drain output to indicate to the host that a headset with a microphone is inserted.. MICP 6 B4 I/O Microphone signal connection to the codec. Microphone bias is applied to this pin. Headset current return path if RING2 is ground for the headset. Connect to 3.5 mm jack RING2 connection RING2 12 D1 O with low DC resistance trace. Connected to the RING2 pin of the 3.5 mm jack. If RING2 pin on plug in is MIC signal, this is connected to RING2_SENSE 7 C4 GND MICP. If not, this is connected to GND_SENSE and becomes the ground sensing feedback for the accessory SCL 9 C3 I Clock from I2C bus. This can be connected to VDD if I2C is not used. SDA 3 B3 I/O Bidirectional data from/to I2C bus. This can be connected to VDD if I2C is not used. Headset current return path if SLEEVE is GND for headset. Connect to 3.5 mm jack SLEEVE connection with SLEEVE 10 D3 O low DC resistance trace. Connected to the SLEEVE pin of the 3.5 mm jack. If SLEEVE pin on plug in is MIC signal, this is connected to SLEEVE_SENSE 8 D4 GND MICP. If not, this is connected to GND_SENSE and becomes the ground sensing feedback for the accessory The THERMAL PAD of the RVA – QFN package must be connected to any internal PCB ground plane using THERMAL PAD GND multiple vias for best thermal performance. TIP 14 C1 I/O Connect to the TIP pin of the 3.5 mm jack. VDD 4 A3 PWR Power input to the TS3A227E. External de-coupling capacitors are required on this pin. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TS3A227E |
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