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CDBA5817 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 1 Page - Comchip Technology

๋ถ€ํ’ˆ๋ช… CDBA5817
์ƒ์„ธ๋‚ด์šฉ  SMD Schottky Barrier Rectifier
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์ œ์กฐ์‚ฌ  COMCHIP [Comchip Technology]
ํ™ˆํŽ˜์ด์ง€  http://www.comchiptech.com
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CDBA5817 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 1 Page - Comchip Technology

   
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Reverse Voltage: 20 - 40 Volts
Forward Current: 1.0 Amp
CDBA5817 Thru CDBA5819
Features
Ideal for surface mount applications
Easy pick and place
Plastic package has Underwriters Lab.
flammability classification 94V-0
Built-in strain relief
Low forward voltage drop
Mechanical data
Case: JEDEC DO-214AC molded plastic
Terminals: solderable per MIL-STD-750,
method 2026
Polarity: Color band denotes cathode
end
Mounting position: Any
Approx. weight:0.064 gram
SMD Schottky Barrier Rectifier
SMD Schottky Barrier Rectifier
www.comchip.com.tw
COMCHIP
COMCHIP
Parameter
Max. Repetitive Peak Reverse Voltage
Max. DC Blocking Voltage
Max. RMS Voltage
Peak Surge Forward Current
8.3ms single half sine-wave
superimposed on rate load
( JEDEC method )
Max. Average Forward Current
Max. Instantaneous Forward Current
at 1.0 A
Max. DC Reverse Current at Rated DC
Blocking Voltage
Ta=25
Ta=100
Max. Thermal Resistance (Note 1)
Operating Junction Temperature
Storage Temperature
Symbol
VRRM
VDC
VRMS
IFSM
I o
V F
I R
R JA
R JL
T j
TSTG
Maximum Ratings and Electrical Characterics
Unit
V
V
V
A
A
V
.
mA
C/W
MDS0308003A
Page 1
Dimensions in inches and (millimeters)
0.008(0.20)
0.004(0.10)
0.067(1.70)
0.051(1.29)
0.090(2.29)
0.067(1.70)
0.059(1.50)
0.035(0.89)
0.110(2.79)
0.086(2.18)
0.180(4.57)
0.160(4.06)
0.012(0.31)
0.006(0.15)
0.209(5.31)
0.185(4.70)
DO-214AC (SMA)
Note 1: Thermal resistance from junction to ambient and junction to to lead P.C.B. Mounted on 0.2 x 0.2 copper pad areas
CDBA5817
CDBA5819
CDBA5818
20
20
14
40
40
28
30
30
21
35
1.0
0.45
0.60
0.55
-50 to +125
88
20
0.5
-65 to +150
10
C
C
C
C


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