DATA SHEET

• PIN DIODE CHIPS SUPPLIED ON FILM FRAME

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

4

January 5, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140L

Grip Ring

0.003 (0.076 mm)

Separation

Between Die

3.940 (100 mm)

Wafer Dia.

5.520 (140.2 mm)

Inner Ring I.D.

5.981 (151.92 mm)

Outer Ring O.D.

0.236 (5.99 mm)

Ring Thickness

 Wafer on nitto tape

 Color: light blue

 Thickness: 2.2 to 3.0 mils

 Tensile strength: 6.6 lbs (in width)

 Ring material: plastic

0.003 (0.076 mm) Nom.

Separation

Between Die

Figure 5. Wafer Film Frame Description