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ADC08200 데이터시트(PDF) 4 Page - Texas Instruments |
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ADC08200 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 27 page ADC08200 SNAS136M – APRIL 2001 – REVISED MARCH 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) Supply Voltage (VA) 3.8V Driver Supply Voltage (VDR) VA +0.3V Voltage on Any Input or Output Pin −0.3V to VA Reference Voltage (VRT, VRB) VA to AGND CLK, PD Voltage Range −0.05V to (VA + 0.05V) Input Current at Any Pin (4) ±25 mA Package Input Current (4) ±50 mA Power Dissipation at TA = 25°C See (5) ESD Susceptibility (6) Human Body Model 2500V Machine Model 200V Soldering Temperature, Infrared, 10 seconds (7) 235°C Storage Temperature −65°C to +150°C (1) All voltages are measured with respect to GND = AGND = DR GND = 0V, unless otherwise specified. (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) When the input voltage at any pin exceeds the power supplies (that is, less than AGND or DR GND, or greater than VA or VDR), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. (5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation listed above will be reached only when this device is operated in a severe fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. (6) Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 220 pF discharged through ZERO Ohms. (7) See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability” (SNOA742). Operating Ratings (1) (2) Operating Temperature Range −40°C ≤ TA ≤ +105°C Supply Voltage (VA) +2.7V to +3.6V Driver Supply Voltage (VDR) +2.4V to VA Ground Difference |GND - DR GND| 0V to 300 mV Upper Reference Voltage (VRT) 0.5V to (VA −0.3V) Lower Reference Voltage (VRB) 0V to (VRT −0.5V) VIN Voltage Range VRB to VRT (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) All voltages are measured with respect to GND = AGND = DR GND = 0V, unless otherwise specified. Package Thermal Resistance Package θJA 24-Lead TSSOP 92°C/W 4 Submit Documentation Feedback Copyright © 2001–2013, Texas Instruments Incorporated Product Folder Links: ADC08200 |
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