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900-0380801 데이터시트(PDF) 5 Page - Texas Instruments |
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900-0380801 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 32 page TPS3808 www.ti.com SBVS050K – MAY 2004 – REVISED OCTOBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD –0.3 7 V Voltage VCT –0.3 VDD + 0.3 V VRESET, VMR, VSENSE –0.3 7 V Current RESET pin –5 5 mA Operating junction, TJ (2) –40 150 °C Temperature Storage, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) As a result of the low dissipated power in this device, it is assumed that TJ = TA. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, ±2000 all pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification ±500 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Input supply range 1.7 6.5 V VSENSE SENSE pin voltage 0 6.5 V V(Ct) CT pin voltage VDD V VMR MR pin voltage 0 6.5 V VRESET RESET pin voltage 0 6.5 V IRESET RESET pin current 0.0003 5 mA 7.4 Thermal Information TPS3808 THERMAL METRIC(1) DBV (SOT-23) DRV (WSON) UNIT 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 180.9 178.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 117.8 95.6 °C/W RθJB Junction-to-board thermal resistance 27.8 135 °C/W ψJT Junction-to-top characterization parameter 1.12 6.3 °C/W ψJB Junction-to-board characterization parameter 27.3 136.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 7.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPS3808 |
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