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CSD19538Q2 데이터시트(PDF) 8 Page - Texas Instruments |
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CSD19538Q2 데이터시트(HTML) 8 Page - Texas Instruments |
8 / 14 page C 6X 0.35 0.25 0.95±0.1 6X 0.3 0.2 2X 1.3 0.3±0.05 4X 0.65 0.8 MAX 0.05 0.00 0.75±0.1 1±0.1 A 2.1 1.9 B 2.1 1.9 (0.47) (0.2) (0.2) (0.2) TYP (0.5) PIN 1 INDEX AREA SEATING PLANE 1 3 4 6 X0.3) (45 PIN 1 ID 0.1 C A B 0.05 C 8 7 PKG PKG 8 CSD19538Q2 SLPS582 – JULY 2016 www.ti.com Product Folder Links: CSD19538Q2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 7.1 Q2 Package Dimensions 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance. |
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유사한 설명 - CSD19538Q2 |
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