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FDC1004DGSR 데이터시트(PDF) 5 Page - Texas Instruments |
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FDC1004DGSR 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 33 page FDC1004 www.ti.com SNOSCY5B – AUGUST 2014 – REVISED APRIL 2015 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT Input voltage VDD –0.3 6 V SCL, SDA –0.3 6 V at any other pin –0.3 VDD+0.3 V Input current at any pin 3 mA Junction temperature(2) 150 °C Storage temperature TSTG –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The maximum power dissipation is a function of TJ(MAX), RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ RθJA. All numbers apply for packages soldered directly onto a PC board. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC ±1000 JS-001, all pins(2) V(ESD) Electrostatic discharge(1) V Charged device model (CDM), per JEDEC ±250 specification -500 500 JESD22-C101, all pins(3) (1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device. (2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over operating temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage (VDD-GND) 3 3.3 3.6 V Temperature –40 125 °C 7.4 Thermal Information FDC1004 THERMAL METRIC(1) WSON (DSC) VSSOP (DGS) UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 46.8 46.8 °C/W RθJC Junction-to-case(top) thermal resistance 46.7 48.7 °C/W RθJB Junction-to-board thermal resistance 21.5 70.6 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: FDC1004 |
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