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LM3423-Q1 데이터시트(PDF) 5 Page - Texas Instruments |
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LM3423-Q1 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 72 page LM3421, LM3421-Q1, LM3423, LM3423-Q1 www.ti.com SNVS574F – JULY 2008 – REVISED JULY 2015 6.2 ESD Ratings: LM3421, LM3423 VALUE UNIT LM3421, LM3423 Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 LM3421-Q1, LM3423-Q1, LM3421-Q0, LM3423-Q0 Human body model (HBM), per AEC Q100-002(3) ±2000 V(ESD) Electrostatic discharge Charged-device model (CDM), per AEC Q100-011 All Pins ±750 V Pin 4 ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. (3) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions MIN MAX UNIT LM3421, LM3421Q1, −40 125 °C Operating junction LM3423, LM3423Q1 temperature LM3421Q0, LM3423Q0 −40 150 °C Input voltage VIN 4.5 75 V 6.4 Thermal Information LM3421, LM3423, LM3421-Q1 LM3423-Q1 THERMAL METRIC(1) UNIT PWP (HTSSOP) PWP (HTSSOP) 16 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 38.9 36.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 23.1 21.5 °C/W RθJB Junction-to-board thermal resistance 16.8 18 °C/W ψJT Junction-to-top characterization parameter 0.6 0.5 °C/W ψJB Junction-to-board characterization parameter 16.6 17.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 1.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2008–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM3421 LM3421-Q1 LM3423 LM3423-Q1 |
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