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TMP007 데이터시트(PDF) 1 Page - Texas Instruments |
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TMP007 데이터시트(HTML) 1 Page - Texas Instruments |
1 / 55 page V+ AGND DGND 16-Bit ADC Gain Local Temperature IR Thermopile Sensor Voltage Reference Digital Control and Math Engine I 2C and SMBus Compatible Digital Interface ALERT ADR0 ADR1 SCL SDA TMP007 EEPROM Thot Tcold Thot Thot Thot + Product Folder Sample & Buy Technical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP007 SBOS685C – APRIL 2014 – REVISED JULY 2015 TMP007 Infrared Thermopile Sensor with Integrated Math Engine 1 1 Features 1 • Integrated MEMS Thermopile for Noncontact Temperature Sensing • 14-Bit Local Temperature Sensor for Cold Junction Reference – ±1°C (max) from 0°C to +60°C – ±1.5°C (max) from –40°C to +125°C • Integrated Math Engine – Directly Read Object Temperature – Programmable Alerts – Nonvolatile Memory for Storing Calibration Coefficients – Transient Correction • Two-Wire Serial Interface Options – I2C and SMBus Compatible – Eight Programmable Addresses • Low Power – Supply: 2.5 V to 5.5 V – Active Current: 270 μA (typ) – 2-µA Shutdown (max) • Compact Package – 1.9-mm × 1.9-mm × 0.625-mm DSBGA 2 Applications • Noncontact Temperature Sensing – Case Temperature – Laser Printers – Power Relays – Health and Beauty – HVAC Comfort Optimization • Gas Concentration • Flame Detection 3 Description The TMP007 is a fully-integrated microelectro- mechanical system (MEMS) thermopile sensor that measures the temperature of an object without direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view. The internal math engine combines the corresponding change in voltage across the thermopile with the internal cold-junction reference temperature sensor to calculate the target object temperature. The TMP007 also provides nonvolatile memory for storing calibration coefficients. The TMP007 is designed with portability and power in mind, and can easily be placed in the tightest of spaces while using standard surface-mount assembly processes. Low power consumption also makes it well suited for battery-powered applications. The TMP006 offers a reduced feature set. The TMP006 offers similar performance as the TMP007, but does not contain the math engine or nonvolatile memory. The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C). Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TMP007 DSBGA (8) 1.90 mm × 1.90 mm (1) For all available packages, see the package option addendum at the end of the datasheet. Functional Block Diagram |
유사한 부품 번호 - TMP007_16 |
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유사한 설명 - TMP007_16 |
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