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TMP007 데이터시트(PDF) 1 Page - Texas Instruments

부품명 TMP007
상세설명  Infrared Thermopile Sensor with Integrated Math Engine
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TMP007 데이터시트(HTML) 1 Page - Texas Instruments

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V+
AGND
DGND
16-Bit
ADC
Gain
Local
Temperature
IR
Thermopile
Sensor
Voltage
Reference
Digital
Control
and
Math Engine
I
2C and
SMBus
Compatible
Digital
Interface
ALERT
ADR0
ADR1
SCL
SDA
TMP007
EEPROM
Thot
Tcold
Thot
Thot
Thot
+
Product
Folder
Sample &
Buy
Technical
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Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP007
SBOS685C – APRIL 2014 – REVISED JULY 2015
TMP007 Infrared Thermopile Sensor with Integrated Math Engine
1
1 Features
1
Integrated MEMS Thermopile for Noncontact
Temperature Sensing
14-Bit Local Temperature Sensor for Cold
Junction Reference
±1°C (max) from 0°C to +60°C
±1.5°C (max) from –40°C to +125°C
Integrated Math Engine
Directly Read Object Temperature
Programmable Alerts
Nonvolatile Memory for Storing Calibration
Coefficients
Transient Correction
Two-Wire Serial Interface Options
I2C and SMBus Compatible
Eight Programmable Addresses
Low Power
Supply: 2.5 V to 5.5 V
Active Current: 270
μA (typ)
2-µA Shutdown (max)
Compact Package
1.9-mm × 1.9-mm × 0.625-mm DSBGA
2 Applications
Noncontact Temperature Sensing
Case Temperature
Laser Printers
Power Relays
Health and Beauty
HVAC Comfort Optimization
Gas Concentration
Flame Detection
3 Description
The
TMP007
is
a
fully-integrated
microelectro-
mechanical system (MEMS) thermopile sensor that
measures the temperature of an object without direct
contact. The thermopile absorbs passive infrared
energy from an object at wavelengths between 4 um
to 16 um within the end-user defined field of view.
The
internal
math
engine
combines
the
corresponding
change
in
voltage
across
the
thermopile with the internal cold-junction reference
temperature sensor to calculate the target object
temperature. The TMP007 also provides nonvolatile
memory for storing calibration coefficients.
The TMP007 is designed with portability and power in
mind, and can easily be placed in the tightest of
spaces while using standard surface-mount assembly
processes. Low power consumption also makes it
well suited for battery-powered applications.
The TMP006 offers a reduced feature set. The
TMP006 offers similar performance as the TMP007,
but does not contain the math engine or nonvolatile
memory.
The Infrared thermopile sensor is specified to operate
from –40°C to +125°C. It is possible to measure
object temperature beyond the device operating
range as long as the device itself does not exceed
the operating temperature range (–40°C to +125°C).
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TMP007
DSBGA (8)
1.90 mm × 1.90 mm
(1) For all available packages, see the package option addendum
at the end of the datasheet.
Functional Block Diagram


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