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MC1558TDC1 데이터시트(PDF) 2 Page - Texas Instruments |
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MC1558TDC1 데이터시트(HTML) 2 Page - Texas Instruments |
2 / 4 page MC1558-DIE SLOS847 – APRIL 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION BACKSIDE BOND PAD BOND PAD DIE THICKNESS BACKSIDE FINISH POTENTIAL METALLIZATION COMPOSITION THICKNESS 10.5 mils. Silicon with backgrind Floating AlCuTiW 1627 nm Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1OUT 1 215.9 810.26 304.8 906.78 1IN- 2 121.92 271.78 218.44 365.76 1IN+ 3 121.92 120.65 218.44 217.17 VCC- 4 683.26 124.46 779.78 220.98 2IN+ 5 1244.6 120.65 1341.12 217.17 2IN- 6 1244.6 271.78 1341.12 365.76 2OUT 7 1158.24 810.26 1247.14 906.78 VCC+ 8 683.26 792.48 779.78 894.08 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: MC1558-DIE |
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