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TDA1564TH 데이터시트(PDF) 27 Page - NXP Semiconductors |
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TDA1564TH 데이터시트(HTML) 27 Page - NXP Semiconductors |
27 / 30 page 2004 Jan 27 27 Philips Semiconductors Preliminary specification High efficiency 2 × 25 W/4 Ω stereo car radio power amplifier TDA1564 applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Suitability of IC packages for wave, reflow and dipping soldering methods Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. Hot bar soldering or manual soldering is suitable for PMFP packages. 5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. MOUNTING PACKAGE(1) SOLDERING METHOD WAVE REFLOW(2) DIPPING Through-hole mount CPGA, HCPGA suitable − suitable DBS, DIP, HDIP, RDBS, SDIP, SIL suitable(3) −− Through-hole- surface mount PMFP(4) not suitable not suitable − Surface mount BGA, HTSSON..T(5), LBGA, LFBGA, SQFP, SSOP-T(5), TFBGA, USON, VFBGA not suitable suitable − DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable(6) suitable − PLCC(7), SO, SOJ suitable suitable − LQFP, QFP, TQFP not recommended(7)(8) suitable − SSOP, TSSOP, VSO, VSSOP not recommended(9) suitable − CWQCCN..L(11), PMFP(10), WQCCN32L(11) not suitable not suitable − |
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