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TPS562200 데이터시트(PDF) 5 Page - Texas Instruments |
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TPS562200 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 32 page 5 TPS562200, TPS563200 www.ti.com SLVSCB0D – JANUARY 2014 – REVISED JUNE 2016 Product Folder Links: TPS562200 TPS563200 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings (1) TJ = -40°C to 150°C(unless otherwise noted) MIN MAX UNIT Input voltage range VIN, EN –0.3 19 V VBST –0.3 25 V VBST (10 ns transient) –0.3 27.5 V VBST (vs SW) –0.3 6.5 V VFB –0.3 6.5 V SW –2 19 V SW (10 ns transient) –3.5 21 V Operating junction temperature, TJ –40 150 °C Storage temperature range, Tstg –55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 6.3 Recommended Operating Conditions TJ = -40°C to 150°C(unless otherwise noted) MIN MAX UNIT VIN Supply input voltage range 4.5 17 V VI Input voltage range VBST –0.1 23 V VBST (10 ns transient) –0.1 26 VBST(vs SW) –0.1 6 EN –0.1 17 VFB –0.1 5.5 SW –1.8 17 SW (10 ns transient) –3.5 20 TA Operating free-air temperature –40 85 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC (1) TPS562200 TPS563200 UNITS DDC (SOT) DDC (SOT) (6 PINS) (6 PINS) RθJA Junction-to-ambient thermal resistance 89.0 87.9 °C/W RθJCtop Junction-to-case (top) thermal resistance 44.5 42.2 RθJB Junction-to-board thermal resistance 13.4 13.6 ψJT Junction-to-top characterization parameter 2.2 1.9 ψJB Junction-to-board characterization parameter 13.2 13.3 |
유사한 부품 번호 - TPS562200_16 |
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유사한 설명 - TPS562200_16 |
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