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LM360 데이터시트(PDF) 2 Page - National Semiconductor (TI) |
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LM360 데이터시트(HTML) 2 Page - National Semiconductor (TI) |
2 / 7 page Absolute Maximum Ratings (Notes 6, 8) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Positive Supply Voltage +8V Negative Supply Voltage −8V Peak Output Current 20 mA Differential Input Voltage ±5V Input Voltage V + ≥ V IN ≥ V − ESD Tolerance (Note 9) 1600V Operating Temperature Range LM160 −55˚C to +125˚C LM360 0˚C to +70˚C Storage Temperature Range −65˚C to +150˚C Lead Temperature (Soldering, 10 sec.) 260˚C Soldering Information Dual-In-Line Package Soldering (10 seconds) 260˚C Small Outline Package Vapor Phase (60 seconds) 215˚C Infrared (15 seconds) 220˚C See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices. Electrical Characteristics (T MIN ≤ TA ≤ TMAX) Parameter Conditions Min Typ Max Units Operating Conditions Supply Voltage V CC + 4.5 5 6.5 V Supply Voltage V CC − −4.5 −5 −6.5 V Input Offset Voltage R S ≤ 200Ω 25 mV Input Offset Current 0.5 3 µA Input Bias Current 520 µA Output Resistance (Either Output) V OUT = VOH 100 Ω Response Time T A = 25˚C, VS = ±5V (Notes 2, 7) 13 25 ns T A = 25˚C, VS = ±5V (Notes 3, 7) 12 20 ns T A = 25˚C, VS = ±5V (Notes 4, 7) 14 ns Response Time Difference between Outputs (t pd of +VIN1)−(tpd of −VIN2)TA = 25˚C (Notes 2, 7) 2 ns (t pd of +VIN2)−(tpd of −VIN1)TA = 25˚C (Notes 2, 7) 2 ns (t pd of +VIN1)−(tpd of +VIN2)TA = 25˚C (Notes 2, 7) 2 ns (t pd of −VIN1)−(tpd of −VIN2)TA = 25˚C (Notes 2, 7) 2 ns Input Resistance f = 1 MHz 17 k Ω Input Capacitance f = 1 MHz 3 pF Average Temperature Coefficient of R S = 50Ω 8 µV/˚C Input Offset Voltage Average Temperature Coefficient of 7 nA/˚C Input Offset Current Common Mode Input Voltage Range V S = ±6.5V ±4 ±4.5 V Differential Input Voltage Range ±5V Output High Voltage (Either Output) I OUT = −320 µA, VS = ±4.5V 2.4 3 V Output Low Voltage (Either Output) I SINK = 6.4 mA 0.25 0.4 V Positive Supply Current V S = ±6.5V 18 32 mA Negative Supply Current V S = ±6.5V −9 −16 mA Note 2: Response time measured from the 50% point of a 30 mVp-p 10 MHz sinusoidal input to the 50% point of the output. Note 3: Response time measured from the 50% point of a 2 Vp-p 10 MHz sinusoidal input to the 50% point of the output. Note 4: Response time measured from the start of a 100 mV input step with 5 mV overdrive to the time when the output crosses the logic threshold. Note 5: Typical thermal impedances are as follows: Cavity DIP (J): θjA 135˚C/W Header (H) θjA 165˚C/W (Still Air) Molded DIP (N): θjA 130˚C/W 67˚C/W (400 LF/min Air Flow) θjC 25˚C/W Note 6: The device may be damaged if used beyond the maximum ratings. Note 7: Measurements are made in AC Test Circuit, Fanout = 1 Note 8: Refer to RETS 160X for LM160H, LM160J-14 and LM160J military specifications. www.national.com 2 |
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