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ADP7156ACPZ-3.0-R7 데이터시트(PDF) 7 Page - Analog Devices |
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ADP7156ACPZ-3.0-R7 데이터시트(HTML) 7 Page - Analog Devices |
7 / 23 page ADP7156 Data Sheet Rev. A | Page 6 of 22 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 1 VOUT NOTES 1. THE EXPOSED PAD IS LOCATED ON THE BOTTOM OF THE PACKAGE. THE EXPOSED PAD ENHANCES THERMAL PERFORMACE, AND IT IS ELECTRICALLY CONNECTED TO GROUND INSIDE THE PACKAGE. CONNECT THE EXPOSED PAD TO THE GROUND PLANE ON THE BOARD TO ENSURE PROPER OPERATION. 2 VOUT 3 VOUT_SENSE 4 BYP 5 EN 10 VIN 9 VIN 8 VREG 7 REF 6 REF_SENSE ADP7156 TOP VIEW (Not to Scale) Figure 3. 10-Lead LFCSP Pin Configuration NOTES 1. THE EXPOSED PAD IS LOCATED ON THE BOTTOM OF THE PACKAGE. THE EXPOSED PAD ENHANCES THERMAL PERFORMACE, AND IT IS ELECTRICALLY CONNECTED TO GROUND INSIDE THE PACKAGE. CONNECT THE EXPOSED PAD TO THE GROUND PLANE ON THE BOARD TO ENSURE PROPER OPERATION. VOUT VOUT_SENSE BYP EN VIN VREG REF REF_SENSE ADP7156 TOP VIEW (Not to Scale) 1 2 3 4 8 7 6 5 Figure 4. 8-Lead SOIC Pin Configuration Table 6. Pin Function Descriptions Pin No. LFCSP SOIC Mnemonic Description 1, 2 1 VOUT Regulated Output Voltage. Bypass VOUT to ground with a 10 µF or greater capacitor. 3 2 VOUT_SENSE Output Sense. VOUT_SENSE is internally connected to VOUT with a 10 Ω resistor. Connect VOUT_SENSE as close to the load as possible. 4 3 BYP Low Noise Bypass Capacitor. Connect a 1 µF capacitor from the BYP pin to ground to reduce noise. Do not connect a load to this pin. 5 4 EN Enable. Drive EN high to turn on the regulator; drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 6 5 REF_SENSE Reference Sense. Connect REF_SENSE to the REF pin. Do not connect REF_SENSE to VOUT or GND. 7 6 REF Low Noise Reference Voltage Output. Bypass REF to ground with a 1 µF or greater capacitor. Short REF_SENSE to REF for fixed output voltages. Do not connect a load to this pin. 8 7 VREG Regulated Input Supply Voltage to Low Dropout (LDO) Amplifier. Bypass VREG to ground with a 1 µF or greater capacitor. 9, 10 8 VIN Regulator Input Supply Voltage. Bypass VIN to ground with a 10 µF or greater capacitor. EP Exposed Pad. The exposed pad is located on the bottom of the package. The exposed pad enhances thermal performance, and it is electrically connected to ground inside the package. Connect the exposed pad to the ground plane on the board to ensure proper operation. |
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