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7WB3305MUTAG ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 3 Page - ON Semiconductor

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์ œ์กฐ์‚ฌ  ONSEMI [ON Semiconductor]
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7WB3305
http://onsemi.com
3
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
โˆ’0.5 to +7.0
V
VIN
Control Pin Input Voltage
โˆ’0.5 to +7.0
V
VI/O
Switch Input / Output Voltage
โˆ’0.5 to +7.0
V
IIK
Control Pin DC Input Diode Current
VIN < GND
โˆ’50
mA
IOK
Switch I/O Port DC Diode Current
VI/O < GND
โˆ’50
mA
IO
ONโˆ’State Switch Current
$128
mA
Continuous Current Through VCC or GND
$150
mA
ICC
DC Supply Current Per Supply Pin
$150
mA
IGND
DC Ground Current per Ground Pin
$150
mA
TSTG
Storage Temperature Range
โˆ’65 to +150
ยฐC
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
ยฐC
TJ
Junction Temperature Under Bias
150
ยฐC
qJA
Thermal Resistance
UDFN8 (Note 1)
Micro8
111
392
ยฐC/W
PD
Power Dissipation in Still Air at 85
ยฐC
UDFN8
Micro8
1127
319
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating Oxygen Index: 28 to 34
UL 94 Vโˆ’0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Mode (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
ILATCHUP
Latchup Performance Above VCC and Below GND at 125ยฐC (Note 5)
$200
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmโˆ’byโˆ’1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22โˆ’A114โˆ’A.
3. Tested to EIA / JESD22โˆ’A115โˆ’A.
4. Tested to JESD22โˆ’C101โˆ’A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
Positive DC Supply Voltage
4.0
5.5
V
VIN
Control Pin Input Voltage
0
5.5
V
VI/O
Switch Input / Output Voltage
0
5.5
V
TA
Operating Freeโˆ’Air Temperature
โˆ’55
+125
ยฐC
Dt/DV
Input Transition Rise or Fall Rate
Control Input
Switch I/O
0
0
5
DC
nS/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.


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