7WBD383

http://onsemi.com

11

PACKAGE DIMENSIONS

US8

CASE 493

ISSUE B

DIM

A

MIN

MAX

MIN

MAX

INCHES

1.90

2.10

0.075

0.083

MILLIMETERS

B

2.20

2.40

0.087

0.094

C

0.60

0.90

0.024

0.035

D

0.17

0.25

0.007

0.010

F

0.20

0.35

0.008

0.014

G

0.50 BSC

0.020 BSC

H

0.40 REF

0.016 REF

J

0.10

0.18

0.004

0.007

K

0.00

0.10

0.000

0.004

L

3.00

3.20

0.118

0.126

M

0

6

0

6

N

5

10

5

10

P

0.23

0.34

0.010

0.013

R

0.23

0.33

0.009

0.013

S

0.37

0.47

0.015

0.019

U

0.60

0.80

0.024

0.031

V

0.12 BSC

0.005 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION “A” DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR.

MOLD FLASH. PROTRUSION AND GATE

BURR SHALL NOT EXCEED 0.140 MM

(0.0055”) PER SIDE.

4. DIMENSION “B” DOES NOT INCLUDE

INTER−LEAD FLASH OR PROTRUSION.

INTER−LEAD FLASH AND PROTRUSION

SHALL NOT E3XCEED 0.140 (0.0055”) PER

SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203 MM.

(300−800 “).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED

±0.0508 (0.0002 “).

L

B

A

P

G

4

1

5

8

C

K

D

SEATING

J

S

R

U

DETAIL E

V

F

H

N

R 0.10 TYP

M

−Y−

−X−

−T−

DETAIL E

T

M

0.10 (0.004)

XY

T

0.10 (0.004)

__

__

__

__

PLANE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 8:1

3.8

0.15

0.50

0.0197

1.0

0.0394

0.30

0.012

1.8

0.07