REV. A

–10–

AD5543/AD5553

OUTLINE DIMENSIONS

8-Lead microSOIC Package [MSOP]

(RM-8)

Dimensions shown in millimeters

0.23

0.08

0.80

0.40

8

0

85

4

1

4.90

BSC

PIN 1

0.65 BSC

3.00

BSC

SEATING

PLANE

0.15

0.00

0.38

0.22

1.10 MAX

3.00

BSC

COMPLIANT TO JEDEC STANDARDS MO-187AA

COPLANARITY

0.10

8-Lead Standard Small Outline Package [SOIC]

Narrow Body

(RN-8)

Dimensions shown in millimeters and (inches)

0.25 (0.0098)

0.19 (0.0075)

1.27 (0.0500)

0.41 (0.0160)

0.50 (0.0196)

0.25 (0.0099)

45

8

0

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

85

4

1

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2440)

5.80 (0.2284)

0.51 (0.0201)

0.33 (0.0130)

COPLANARITY

0.10

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

COMPLIANT TO JEDEC STANDARDS MS-012AA