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MC74AC4040DG 데이터시트(PDF) 3 Page - ON Semiconductor

부품명 MC74AC4040DG
상세설명  12-Stage Binary Ripple Counter
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제조업체  ONSEMI [ON Semiconductor]
홈페이지  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC74AC4040DG 데이터시트(HTML) 3 Page - ON Semiconductor

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MC74AC4040
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MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VI
DC Input Voltage
*0.5 ≤ VCC +0.5
V
VO
DC Output Voltage (Note 1)
*0.5 ≤ VCC +0.5
V
IIK
DC Input Diode Current
±20
mA
IOK
DC Output Diode Current
±50
mA
IO
DC Output Sink/Source Current
±50
mA
ICC
DC Supply Current per Output Pin
±50
mA
IGND
DC Ground Current per Output Pin
±50
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction temperature under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
69.1
°C/W
PD
Power Dissipation in Still Air at 65
°C (Note 3)
500
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
VESD
ESD Withstand Voltage
Human Body Model (Note 4)
Machine Model (Note 5)
Charged Device Model (Note 6)
> 2000
> 200
> 1000
V
ILatch−Up
Latch−Up Performance
Above VCC and Below GND at 85°C (Note 7)
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. 500 mW at 65
°C; derate to 300 mW by 10 mW/ from 65°C to 85°C.
4. Tested to EIA/JESD22−A114−A.
5. Tested to EIA/JESD22−A115−A.
6. Tested to JESD22−C101−A.
7. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
VIN/VOUT
Input Voltage, Output Voltage (Referenced to GND)
0
VCC
TA
Operating Temperature, All Package Types
−40
+85
°C
tr/tf
Input Rise/Fall Time
(Figure 1)
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
0
0
0
150
40
25
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.


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