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IRL7472L1PBF 데이터시트(PDF) 2 Page - Infineon Technologies AG

부품명 IRL7472L1PBF
상세설명  DirectFET짰 N-Channel Power MOSFET
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제조업체  INFINEON [Infineon Technologies AG]
홈페이지  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

IRL7472L1PBF 데이터시트(HTML) 2 Page - Infineon Technologies AG

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IRL7472L1TRPbF
 
2
2016-8-9
Notes:
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
Used double sided cooling , mounting pad with large heatsink.
Absolute Maximum Ratings
  
 
Symbol
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
645
A  
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)
456
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
68
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Package Limited)
375
IDM
Pulsed Drain Current 
1500
         A 
PD @TC = 25°C
Maximum Power Dissipation
341
PD @TA = 25°C
Maximum Power Dissipation
3.8
Linear Derating Factor
0.025
W/°C
VGS
Gate-to-Source Voltage
± 20
V
TJ
Operating Junction and
-55 to + 175
°C
TSTG
Storage Temperature Range
Avalanche Characteristics
  
EAS (Thermally limited)
Single Pulse Avalanche Energy 
308
mJ
EAS (Thermally limited)
Single Pulse Avalanche Energy 
765
IAR
Avalanche Current 
See Fig.15,16, 23a, 23b
A
EAR
Repetitive Avalanche Energy 
mJ
Thermal Resistance
  
 
Symbol
Parameter
Typ.
Max.
Units
RJA
Junction-to-Ambient 
–––
40
°C/W
RJA
Junction-to-Ambient 
12.5
–––
RJA
Junction-to-Ambient 
20
–––
RJC
Junction-to-Case 
–––
0.44
RJA-PCB
Junction-to-PCB Mounted
1.0
–––
W
Static @ TJ = 25°C (unless otherwise specified)
   
 
 
 
Symbol
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
40
–––
–––
V
VGS = 0V, ID = 250µA
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient
–––
30
––– mV/°C Reference to 25°C, ID = 5.0mA
RDS(on)
Static Drain-to-Source On-Resistance
–––
0.34 0.45
m

VGS = 10V, ID = 195A 
––– 0.52 0.70
VGS = 4.5V, ID = 98A 
VGS(th)
Gate Threshold Voltage
1.0
1.7
2.5
V
VDS = VGS, ID = 250µA
IDSS
Drain-to-Source Leakage Current
–––
–––
1.0
µA
VDS = 40V, VGS = 0V
–––
–––
150
VDS = 40V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
–––
–––
100
VGS = 20V
Gate-to-Source Reverse Leakage
–––
–––
-100
VGS = -20V
RG
Internal Gate Resistance
–––
1.0
–––
nA
TC measured with thermocouple mounted to top (Drain) of part.
Surface mounted on 1 in. square Cu
board (still air).
Mounted to a PCB with small clip
heatsink (still air)
 
Mounted on minimum footprint full size
board with metalized back and with
small clip heatsink (still air)


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