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TMP423-Q1 데이터시트(PDF) 5 Page - Texas Instruments |
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TMP423-Q1 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 38 page 5 TMP421-Q1, TMP422-Q1, TMP423-Q1 www.ti.com SBOS821 – NOVEMBER 2016 Product Folder Links: TMP421-Q1 TMP422-Q1 TMP423-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Power supply, VS 7 V Input voltage Pins 1, 2, 3, and 4 only –0.5 VS + 0.5 V Pins 6 and 7 only –0.5 7 Input current 10 mA Operational temperature –55 127 °C Junction temperature, TJ max 150 °C Storage temperature, Tstg –60 130 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±3000 V Charged-device model (CDM), per AEC Q100-011 ±750 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Temperature –40 125 °C Power-supply voltage 2.7 5.5 V (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TMP42x-Q1 UNIT DCN (SOT-23) 8 PINS RθJA Junction-to-ambient thermal resistance 147 °C/W RθJC(top) Junction-to-case (top) thermal resistance 115 °C/W RθJB Junction-to-board thermal resistance 33 °C/W ψJT Junction-to-top characterization parameter 38 °C/W ψJB Junction-to-board characterization parameter 33 °C/W |
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