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TMP423-Q1 데이터시트(PDF) 5 Page - Texas Instruments

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부품명 TMP423-Q1
상세설명  Remote and Local Temperature Sensor
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
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TMP423-Q1 데이터시트(HTML) 5 Page - Texas Instruments

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TMP421-Q1, TMP422-Q1, TMP423-Q1
www.ti.com
SBOS821 – NOVEMBER 2016
Product Folder Links: TMP421-Q1 TMP422-Q1 TMP423-Q1
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Power supply, VS
7
V
Input voltage
Pins 1, 2, 3, and 4 only
–0.5
VS + 0.5
V
Pins 6 and 7 only
–0.5
7
Input current
10
mA
Operational temperature
–55
127
°C
Junction temperature, TJ max
150
°C
Storage temperature, Tstg
–60
130
°C
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002(1)
±3000
V
Charged-device model (CDM), per AEC Q100-011
±750
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Temperature
–40
125
°C
Power-supply voltage
2.7
5.5
V
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
TMP42x-Q1
UNIT
DCN (SOT-23)
8 PINS
RθJA
Junction-to-ambient thermal resistance
147
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
115
°C/W
RθJB
Junction-to-board thermal resistance
33
°C/W
ψJT
Junction-to-top characterization parameter
38
°C/W
ψJB
Junction-to-board characterization parameter
33
°C/W


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