MOTOROLA CMOS LOGIC DATA

7

MC14544B

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

CASE 726–04

ISSUE G

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION F FOR FULL LEADS. HALF

LEADS OPTIONAL AT LEAD POSITIONS 1, 9,

10, AND 18.

1

SEATING

PLANE

10

9

18

M

K

C

N

F

G

D

L

–A–

–B–

18 PL

–T–

S

A

M

0.25 (0.010)

T

S

B

M

0.25 (0.010)

T

OPTIONAL LEAD

CONFIGURATION (1, 9, 10, 18)

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

22.35

23.11

0.880

0.910

B

6.10

7.49

0.240

0.295

C

–––

5.08

–––

0.200

D

0.38

0.53

0.015

0.021

G

2.54 BSC

0.100 BSC

J

0.20

0.30

0.008

0.012

K

3.18

4.32

0.125

0.170

L

7.62 BSC

0.300 BSC

M

0

15

0

15

N

0.51

1.02

0.020

0.040

_

_

_

_

F

1.40

1.78

0.055

0.070

P SUFFIX

PLASTIC DIP PACKAGE

CASE 707–02

ISSUE C

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D),

SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM

MATERIAL CONDITION, IN RELATION TO

SEATING PLANE AND EACH OTHER.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

1

SEATING

PLANE

10

9

18

M

A

B

K

C

N

F

G

D

H

J

L

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

22.22

23.24

0.875

0.915

B

6.10

6.60

0.240

0.260

C

3.56

4.57

0.140

0.180

D

0.36

0.56

0.014

0.022

F

1.27

1.78

0.050

0.070

G

2.54 BSC

0.100 BSC

H

1.02

1.52

0.040

0.060

J

0.20

0.30

0.008

0.012

K

2.92

3.43

0.115

0.135

L

7.62 BSC

0.300 BSC

M

0

15

0

15

N

0.51

1.02

0.020

0.040

_

_

_

_

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MC14544B/D

*MC14544B/D*

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