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TLV314-Q1, TLV2314-Q1, TLV4314-Q1

SBOS837 – NOVEMBER 2016

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Product Folder Links: TLV314-Q1 TLV2314-Q1 TLV4314-Q1

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.4 Thermal Information: TLV314-Q1

TLV314-Q1

UNIT

DBV (SOT-23)

DCK (SC70)

5 PINS

5 PINS

Junction-to-ambient thermal resistance

228.5

281.4

°C/W

Junction-to-case(top) thermal resistance

99.1

91.6

°C/W

Junction-to-board thermal resistance

54.6

59.6

°C/W

Junction-to-top characterization parameter

7.7

1.5

°C/W

Junction-to-board characterization parameter

53.8

58.8

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.5 Thermal Information: TLV2314-Q1

TLV2314-Q1

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

138.4

191.2

°C/W

Junction-to-case(top) thermal resistance

89.5

61.9

°C/W

Junction-to-board thermal resistance

78.6

111.9

°C/W

Junction-to-top characterization parameter

29.9

5.1

°C/W

Junction-to-board characterization parameter

78.1

110.2

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.6 Thermal Information: TLV4314-Q1

TLV4314-Q1

UNIT

PW (TSSOP)

14 PINS

Junction-to-ambient thermal resistance

121

°C/W

Junction-to-case(top) thermal resistance

49.4

°C/W

Junction-to-board thermal resistance

62.8

°C/W

Junction-to-top characterization parameter

5.9

°C/W

Junction-to-board characterization parameter

62.2

°C/W