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AD8224HBCPZ-RL 데이터시트(PDF) 10 Page - Analog Devices

부품명 AD8224HBCPZ-RL
상세설명  Precision, Dual-Channel, JFET Input, Rail-to-Rail Instrumentation Amplifier
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
Logo AD - Analog Devices

AD8224HBCPZ-RL 데이터시트(HTML) 10 Page - Analog Devices

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Data Sheet
AD8224
Rev. D | Page 9 of 28
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Rating
Supply Voltage
±18 V
Power Dissipation
See Figure 2
Output Short-Circuit Current
Indefinite1
Input Voltage (Common Mode)
±V
S
Differential Input Voltage
±V
S
Storage Temperature Range
−65°C to +130°C
Operating Temperature Range2
−40°C to +125°C
Lead Temperature (Soldering, 10 sec)
300°C
Junction Temperature
130°C
Package Glass Transition Temperature
130°C
ESD (Human Body Model)
4 kV
ESD (Charge Device Model)
1 kV
ESD (Machine Model)
0.4 kV
1 Assumes the load is referenced to midsupply.
2 Temperature for specified performance is −40°C to +85°C. For performance
to 125°C, see the Typical Performance Characteristics section.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Table 9.
Exposed Pad Package
θ
JA
Unit
CP-16-26: LFCSP, EPAD Soldered to Board
48
°C/W
CP-16-26: LFCSP, EPAD Not Soldered to Board
86
°C/W
Table 10.
Hidden Paddle Package
θ
JA
Unit
CP-16-19: LFCSP
86
°C/W
The θJA values in Table 9 and Table 10 assume a 4-layer JEDEC
standard board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θJC at the exposed pad is
4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8224 is limited
by the associated rise in junction temperature (TJ) on the die. At
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality. Figure 2
shows the maximum safe power dissipation in the package vs.
the ambient temperature for the LFCSP on a 4-layer JEDEC
standard board.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–60
–40
–20
0
20
40
60
80
100
120
140
AMBIENT TEMPERATURE (°C)
θJA = 48°C/W WHEN THERMAL PAD
IS SOLDERED TO BOARD
θJA = 86°C/W WHEN THERMAL PAD
IS NOT SOLDERED TO BOARD
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION


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