전자부품 데이터시트 검색엔진 |
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ADRF5021 데이터시트(PDF) 10 Page - Analog Devices |
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ADRF5021 데이터시트(HTML) 10 Page - Analog Devices |
10 / 12 page ADRF5021 Data Sheet Rev. A | Page 10 of 12 APPLICATIONS INFORMATION EVALUATION BOARD Figure 18 and Figure 19 show the top and cross sectional views of the evaluation board, which uses 4-layer construction with a copper thickness of 0.5 oz (0.7 mil) and dielectric materials between each copper layer. 1500mil 40mil 40mil EDGE PLATING 5 × 520mil 570mil R 32mil Figure 18. Evaluation Board Layout (Top View) 0.5oz Cu (0.7mil) 0.5oz Cu (0.7mil) 0.5oz Cu (0.7mil) 0.5oz Cu (0.7mil) 0.5oz Cu (0.7mil) RO4003 FR4 FR4 0.5oz Cu (0.7mil) W = 14mil G = 5mil T = 0.7mil H = 8mil Figure 19. Evaluation Board (Cross Sectional View) All RF and dc traces are routed on the top copper layer whereas the inner and bottom layers are grounded planes that provide a solid ground for the RF transmission lines. Top dielectric material is 8 mil Rogers RO4003, offering good high frequency performance. The middle and bottom dielectric materials are FR-4 type materials to achieve an overall board thickness of 62 mil. The RF transmission lines were designed using a coplanar waveguide (CPWG) model with a width of 14 mil and ground spacing of 5 mil to have a characteristic impedance of 50 Ω. For good RF and thermal grounding, as many plated through vias as possible are arranged around transmission lines and under the exposed pad of the package. Figure 20 shows the actual ADRF5021 evaluation board with component placement. Two power supply ports are connected to the VDD and VSS test points, TP5 and TP2, and the ground reference is connected to the GND test point, TP1. On each supply trace, a 100 pF bypass capacitor is used, and unpopulated components positions are available for applying extra bypass capacitors. Figure 20. Populated Evaluation Board Two control ports are connected to the EN and CTRL test points, TP3 and TP4. On each control trace, a resistor position is available to improve the isolation between the RF and control signals. The RF ports are connected to the RFC, RF1, and RF2 connectors (J1, J2, and J3) that are end launch 2.4 mm RF connectors. A through transmission line that connects unpopulated RF connectors (J7 and J8) is also available to measure the loss of the PCB. Figure 21 and Table 5 are the evaluation board schematic and bill of materials, respectively. The evaluation board shown in Figure 20 is available from Analog Devices, Inc., upon request. |
유사한 부품 번호 - ADRF5021 |
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유사한 설명 - ADRF5021 |
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