TS61001

Final Datasheet

Rev 1.2

March 19, 2015

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Absolute Maximum Rating

Thermal Characteristics

Parameter

Value

Unit

VCCG, VCC

13.2

V

VB1, VB2

13.2 (relative to VS1, VS2)

V

SDATA, SCLK

3.6

V

LS1ON, LS2ON, HS1ON, HS2ON

3.6

V

COMPN, COMPP, COMPOUT

3.6

V

Electrostatic Discharge – Human Body Model

+/-2k

V

Electrostatic Discharge – Charge Device Model

+/-500

V

Lead Temperature (soldering, 10 seconds)

260

°C

Notes:

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device.These are stress ratings only and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

Symbol

Parameter

Value

Units

Thermal Resistance Junction to Air (Note 1)

34.5

°C/W

Thermal Resistance Junction to Case (Note 1)

2.5

°C/W

Storage Temperature Range

-65 to 150

°C

Maximum Junction Temperature

150

°C

Operating Junction Temperature Range

-40 to 125

°C

Note 1: Assumes 16LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD

Recommended Operating Conditions

Symbol

Parameter

Min Typ

Max

Unit

VCCG / VCC

Input Operating Voltage

5

8

12.5

V

VCCG / VCC Bypass Capacitors

100

nF

10

uF

Internal 3.3V Bypass Capacitor

4.7

uF

Internal 5V Bypass Capacitor

100

nF

Bootstrap Capacitor

47

nF