D

E

A1 orientation

X

Y

A

A1

0.10 Z

0.08 Z

Z

b

e

0.05 X Y

Dimensions are in millimeters.

Interpret dimensions and tolerances per ASME Y14.5M-1994.

1.

Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.

2.

Datum Z (seating plane) is defined by the spherical crowns of the solder balls.

3.

Parallelism measurement shall exclude any effect of mark on top surface of package.

4.

TOP VIEW

SIDE VIEW

BOTTOM VIEW

DIM

MIN

MAX

A

1.0

A1

0.15

0.25

b

0.25

0.35

D

5.0 BSC

E

5.0 BSC

e

0.5 BSC

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: BGA

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. A

DATE: 01/18/2013

Material: N/A

Finish: N/A

Weight: 8.69

SM-BGA-9023 Drawing

SCALE: 10:1

SHEET: 3 OF 4

DRAWN BY: D. Hauer

FILE: SM-BGA-9023 Dwg