TOP VIEW

25.475

3.016

45.14

FRONT VIEW

30.225

4.80

1.516

SIDE VIEW

37.241

64.925

15.225

1.516

SIDE VIEW (Clam shell lid open)

SM-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND

TEST APPLICATIONS

Features

Wide temperature range (-55C to +180C).

•

High current capability (up to 4A).

•

Over 40GHz bandwidth @ -1dB for edge pins

•

Low and stable contact resistance for reliable production yield.

•

Self inductance under 0.21nH

•

Highly compliant to accommodate wide co-planarity variations.

•

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: SM BGA 144 7x7mm IC 0.5mm Pitch

Primary dimension units are millimeters, Secondary dimension units are [inches].

STATUS: Released

REV. B

DATE: 5/15/2013

Material: N/A

Finish: N/A

Weight: 52.07

SM-BGA-9027 Drawing

SCALE: 1.5:1

SHEET: 1 OF 5

DRAWN BY: B. Fedde

FILE: SM-BGA-9027 Dwg