전자부품 데이터시트 검색엔진 |
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SM-BGA-9064 데이터시트(PDF) 2 Page - Ironwood Electronics. |
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SM-BGA-9064 데이터시트(HTML) 2 Page - Ironwood Electronics. |
2 / 4 page 24.725 Inuslation Plate Outline (blue) 19.725 Mounting Hole Location 9.8625 4.7825 7.3225 7.80 7.55 * 4X 1.700 THRU ALL 2X 0.850±0.025 THRU ALL 0.65 Typ. 22.225 Socket Base Outline (red) 17.325 Socket Base Opening 15.9 BGA Pads A1 Orientation Mark Target PCB Recommendations Total thickness: 1.6mm ± 10% Pads: Hard Gold, ENIPIG, RoHs HASL PCB Pad height: Same or 0.001" lower than solder mask is acceptable. Copper defined solder mask is recommended Note: BGA pattern is not symmetrical with respect to the mounting holes. BGA array is shifted 0.25mm down from center. Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 11/04/2015 Material: N/A Finish: N/A Weight: 17.98 SM-BGA-9064 Drawing SCALE: 3.5:1 SHEET: 2 OF 4 ENG: V. Panavala FILE: SM-BGA-9064 Dwg DRAWN BY: M. Raske |
유사한 부품 번호 - SM-BGA-9064 |
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유사한 설명 - SM-BGA-9064 |
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