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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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F0603C0R37FWTR 데이터시트(PDF) 2 Page - AVX Corporation |
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F0603C0R37FWTR 데이터시트(HTML) 2 Page - AVX Corporation |
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2 / 17 page  8 Accu-Guard® II SMD Thin-Film Fuse Test Conditions Requirement Solderability Components completely immersed in a Terminations to be well tinned solder bath at 235 ±5°C for 2 secs. No visible damage Leach Resistance Completely immersed in a solder bath Dissolution of termination at 260 ±5°C for 60 secs. ≤ 25% of area ΔR/R<10% Storage 12 months minimum with components Good solderability stored in “as received” packaging. Shear Components mounted to a substrate. No visible damage A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Rapid Change of Components mounted to a substrate. No visible damage Temperature 50 cycles -55°C to +125°C. Δ R/R<10% Vibration Per Mil-Std-202F No visible damage Method 201A and ΔR/R<10% Method 204D Condition D. Bend Tested as shown in diagram No visible damage ΔR/R<10% Load Life 25°C, rated current, 20,000 hrs. No visible damage F0805B, F1206B ΔR/R<10% ENVIRONMENTAL CHARACTERISTICS 45mm 45mm 3 mm Deflection |
유사한 부품 번호 - F0603C0R37FWTR |
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유사한 설명 - F0603C0R37FWTR |
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