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LM137QML

SNVS313E – DECEMBER 2010 – REVISED DECEMBER 2016

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(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

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6 Specifications

6.1 Absolute Maximum Ratings

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UNIT

Internally Limited

Input-Output Voltage Differential

40

V

Operating Ambient Temperature

°C

Operating Junction Temperature

°C

Storage Temperature

°C

Maximum Junction Temperature

150

°C

Lead Temperature (Soldering, 10 sec.)

300

°C

Maximum Power Dissipation

(@25°C)

T0–3

28

W

T0–39

2.5

W

Package Weight (typical)

T0–3

12,750

mg

T0–39 Metal Can

955

mg

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JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±4000 V may actually have higher performance. Human

body model, 100 pF discharged through 1.5 K

Ω.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±4000

V

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

°C

Input Voltage

−41.25

−4.25

V

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For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

TO-3 METAL CAN

TO-39 METAL CAN

UNIT

2 PINS

3 PINS

Junction-to-ambient thermal resistance

40 (Still Air)

174 (Still Air @ 0.5W)

°C/W

14 (500 LFM)

64 (500 LFM @ 0.5W)

Junction-to-case thermal resistance

4

15 (@ 1.0W)