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OPT3001IDNPTQ1 데이터시트(PDF) 4 Page - Texas Instruments

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부품명 OPT3001IDNPTQ1
상세설명  Ambient Light Sensor (ALS)
Download  43 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
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OPT3001-Q1
SBOS853 – MARCH 2017
www.ti.com
Product Folder Links: OPT3001-Q1
Submit Documentation Feedback
Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Voltage
VDD to GND
–0.5
6
V
SDA, SCL, INT, and ADDR to GND
–0.5
6
V
Current into any pin
10
mA
Temperature
Junction
150
°C
Storage, Tstg
–65
150(2)
°C
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002(1)
±2000
V
Charged-device model (CDM), per AEC Q100-011
±500
6.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
Operating temperature
–40
85
°C
Operating power-supply voltage
1.6
3.6
V
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
6.4 Thermal Information
THERMAL METRIC(1)
OPT3001-Q1
UNIT
DNP (USON)
6 PINS
RθJA
Junction-to-ambient thermal resistance
71.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
45.7
°C/W
RθJB
Junction-to-board thermal resistance
42.2
°C/W
ψJT
Junction-to-top characterization parameter
2.4
°C/W
ψJB
Junction-to-board characterization parameter
42.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
17.0
°C/W


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