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TMP006AIYZFT 데이터시트(PDF) 2 Page - Texas Instruments |
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TMP006AIYZFT 데이터시트(HTML) 2 Page - Texas Instruments |
2 / 38 page TMP006, TMP006B SBOS518E – MAY 2011 – REVISED APRIL 2015 www.ti.com Table of Contents 8.5 Register Maps ......................................................... 19 1 Features .................................................................. 1 9 Application and Implementation ........................ 21 2 Applications ........................................................... 1 9.1 Application Information............................................ 21 3 Description ............................................................. 1 9.2 Typical Application ................................................. 21 4 Revision History..................................................... 2 9.3 System Examples ................................................... 24 5 Device Comparison Table..................................... 4 10 Power-Supply Recommendations ..................... 26 6 Pin Configuration and Functions ......................... 4 11 Layout................................................................... 27 7 Specifications......................................................... 5 11.1 Layout Guidelines ................................................. 27 7.1 Absolute Maximum Ratings ..................................... 5 11.2 Layout Examples................................................... 28 7.2 ESD Ratings.............................................................. 5 12 Device and Documentation Support ................. 31 7.3 Recommended Operating Conditions ....................... 5 12.1 Device Support .................................................... 31 7.4 Thermal Information .................................................. 5 12.2 Documentation Support ........................................ 31 7.5 Electrical Characteristics.......................................... 6 12.3 Related Links ........................................................ 31 7.6 Typical Characteristics .............................................. 7 12.4 Trademarks ........................................................... 31 8 Detailed Description .............................................. 8 12.5 Electrostatic Discharge Caution ............................ 31 8.1 Overview ................................................................... 8 12.6 Glossary ................................................................ 31 8.2 Functional Block Diagram ......................................... 8 13 Mechanical, Packaging, and Orderable 8.3 Feature Description................................................... 8 Information ........................................................... 32 8.4 Device Functional Modes........................................ 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (November 2014) to Revision E Page • Changed Feature, Applications, and Description sections .................................................................................................... 1 • Changed thermopile sensor portion of simplified schematic .................................................................................................. 1 • Changed operating range minimum value in Absolute Maximum Ratings from –55°C to –40°C .......................................... 5 • Changed Handling Ratings to ESD Ratings and moved storage temperature to Absolute Maximum Ratings ..................... 5 • Changed Figure 3 .................................................................................................................................................................. 7 • Changed thermopile sensor portion of functional block diagram ........................................................................................... 8 • Deleted text at the end of 2nd paragraph in Field of View and Angular Response section ................................................ 10 • Added Figure 8 ..................................................................................................................................................................... 10 • Changed TREG to TDIE in Temperature Format section ........................................................................................................ 15 Changes from Revision C (December 2012) to Revision D Page • Changed all instances of WCSP to DSBGA throughout data sheet ...................................................................................... 1 • Changed document format to latest data sheet standards .................................................................................................... 1 • Added Device Comparison, Handling Rating, and Recommended Operating Conditions tables, and Feature Description, Device Functional Modes, Register Maps, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections................................................................................................................................................................ 1 • Changed text in first paragraph of Description section ......................................................................................................... 1 • Changed all instances of "local temperature" to "die temperature" throughout data sheet .................................................. 1 • Moved histogram from page 1 to Typical Characteristics section.......................................................................................... 1 • Added Simplified Schematic title to front-page figure ............................................................................................................ 1 • Changed simplified schematic ................................................................................................................................................ 1 • Deleted Package Information table ....................................................................................................................................... 4 • Changed all TObject to TOBJ throughout data sheet .................................................................................................................. 6 • Changed x- and y-axis labels in Figure 1 ............................................................................................................................... 7 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TMP006 TMP006B |
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