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INN

INP

GAIN0

GAIN1

SHUTDOWN

PGND

VCLAMP

BSN

OUTN

OUTN

PGND

VREF

BYPASS

COSC

ROSC

AGND

AGND

BSP

OUTP

OUTP

PGND

TPA3007D1

SLOS418D – SEPTEMBER 2003 – REVISED MARCH 2008

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

AVAILABLE OPTIONS

PACKAGED DEVICES

-40

°C to 85°C

TPA3007D1PW

(1)

The PW package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g.,

TPA3007D1PWR).

LEAD (PB)-FREE AND GREEN ORDERING INFORMATION

ORDERED DEVICE

TPA3007D1PWRG4

ACTIVE

Pb-Free and Green

(1)

The marketing status values are defined as follows:

ACTIVE: This device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this

part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued production of the device.

(2)

Eco-Status information – Additional details including specific material content can be accessed at www.ti.com/leadfree

N/A: Not yet available Lead (Pb)-Free; for estimated conversion dates, go to www.ti.com/leadfree.

Pb-Free: TI defines "Lead (Pb)-Free" or "Pb-Free" to mean RoHS compatible, including a lead concentration that does not exceed 0.1%

of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.

Green: TI defines "Green" to mean Lead (Pb)-Free and in addition, uses package materials that do not contain halogens, including

bromine (Br), or antimony (Sb) above 0.1% of total product weight.

PW PACKAGE

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Copyright © 2003–2008, Texas Instruments Incorporated

Product Folder Link(s): TPA3007D1