전자부품 데이터시트 검색엔진 |
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74FST3257DR2 데이터시트(PDF) 7 Page - ON Semiconductor |
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74FST3257DR2 데이터시트(HTML) 7 Page - ON Semiconductor |
7 / 8 page 74FST3257 http://onsemi.com 7 PACKAGE DIMENSIONS QSOP−16 QS SUFFIX CASE 492−01 ISSUE O MAX MILLIMETERS G R −B− −A− L M 0.25 (0.010) T U −T− SEATING PLANE K D 16 PL C M 0.25 (0.010) T BA S S V N J M F 8 PL DETAIL E DETAIL E H x 45 _ RAD. MOLD PIN DIM MIN MAX MIN INCHES A 4.80 4.98 0.189 0.196 B 3.81 3.99 0.150 0.157 C 1.55 1.73 0.061 0.068 D 0.20 0.31 0.008 0.012 F 0.41 0.89 0.016 0.035 G 0.64 BSC 0.025 BSC H 0.20 0.46 0.008 0.018 J 0.249 0.191 0.0098 0.0075 K 0.10 0.25 0.004 0.010 L 5.84 6.20 0.230 0.244 M 0 8 0 8 N 0 7 0 7 P 0.18 0.28 0.007 0.011 Q 0.51 DIA 0.020 DIA R 0.64 0.89 0.025 0.035 U 0.64 0.89 0.025 0.035 V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE ONLY). BOTTOM PACKAGE DIMENSION SHALL FOLLOW THE DIMENSION STATED IN THIS DRAWING. 4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 6 MILS PER SIDE. 5. BOTTOM EJECTOR PIN WILL INCLUDE THE COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D. __ _ _ 0 8 0 __ _ 8 _ __ __ MARK Q P 0.013 X 0.005 DP. MAX RAD. 0.005−0.010 TYP |
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