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SZNUP1301ML3T1G 데이터시트(PDF) 2 Page - ON Semiconductor |
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2 / 4 page NUP1301ML3T1G, SZNUP1301ML3T1G www.onsemi.com 2 MAXIMUM RATINGS (Each Diode) (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Reverse Voltage VR 70 Vdc Forward Current IF 215 mAdc Peak Forward Surge Current IFM(surge) 500 mAdc Repetitive Peak Reverse Voltage VRRM 70 V Average Rectified Forward Current (Note 1) (averaged over any 20 ms period) IF(AV) 715 mA Repetitive Peak Forward Current IFRM 450 mA Non−Repetitive Peak Forward Current t = 1.0 ms t = 1.0 ms t = 1.0 S IFSM 2.0 1.0 0.5 A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 0.75 0.062 in. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance Junction−to−Ambient RqJA 625 °C/W Lead Solder Temperature Maximum 10 Seconds Duration TL 260 °C Junction Temperature TJ −65 to 150 °C Storage Temperature Tstg −65 to +150 °C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) (Each Diode) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Reverse Breakdown Voltage (I(BR) = 100 mA) V(BR) 70 − − Vdc Reverse Voltage Leakage Current (VR = 70 Vdc) (VR = 25 Vdc, TJ = 150°C) (VR = 70 Vdc, TJ = 150°C) IR − − − − − − 2.5 30 50 mAdc Diode Capacitance (between I/O and ground) (VR = 0, f = 1.0 MHz) CD − − 0.9 pF Forward Voltage (IF = 1.0 mAdc) (IF = 10 mAdc) (IF = 50 mAdc) (IF = 150 mAdc) VF − − − − − − − − 715 855 1000 1250 mVdc Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. FR−5 = 1.0 0.75 0.062 in. 3. Alumina = 0.4 0.3 0.024 in, 99.5% alumina. 4. Include SZ-prefix devices where applicable. |
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