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FDC697P 데이터시트(PDF) 2 Page - Fairchild Semiconductor

부품명 FDC697P
상세설명  P-Channel 1.8V PowerTrench MOSFET
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제조업체  FAIRCHILD [Fairchild Semiconductor]
홈페이지  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDC697P 데이터시트(HTML) 2 Page - Fairchild Semiconductor

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FDC697P Rev C2 (W)
Electrical Characteristics
T
A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V,
ID = –250 µA
–20
V
∆BVDSS
∆TJ
Breakdown Voltage Temperature
Coefficient
ID = – 250 µA, Referenced to 25°C
–12.2
mV/
°C
IDSS
Zero Gate Voltage Drain Current
VDS = –16 V,
VGS = 0 V
–1
µA
IGSS
Gate–Body Leakage
VGS = ±8 V,
VDS = 0 V
±100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS,
ID = –250 µA
–0.4
–0.8
–1.5
V
∆VGS(th)
∆TJ
Gate Threshold Voltage
Temperature Coefficient
ID = – 250 µA, Referenced to 25°C
2.9
mV/
°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = –4.5 V,
ID = –8 A
VGS = –2.5 V,
ID = –6.8 A
VGS = –1.8 V,
ID = –5.8 A
VGS = –4.5 V, ID = –8 A, TJ =125°C
13
18
26
16
20
25
35
27
m
gFS
Forward Transconductance
VDS = –5 V,
ID = –8 A
37
S
Dynamic Characteristics
Ciss
Input Capacitance
3524
pF
Coss
Output Capacitance
544
pF
Crss
Reverse Transfer Capacitance
VDS = – 10 V,
V GS = 0 V,
f = 1.0 MHz
254
pF
RG
Gate Resistance
VGS = 15 mV,
f = 1.0 MHz
3.8
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
18
32
ns
tr
Turn–On Rise Time
6
12
ns
td(off)
Turn–Off Delay Time
119
190
ns
tf
Turn–Off Fall Time
VDD = –10 V,
ID = –1 A,
VGS = –4.5 V,
RGEN = 6 Ω
43
69
ns
Qg
Total Gate Charge
39
55
nC
Qgs
Gate–Source Charge
6
8.4
nC
Qgd
Gate–Drain Charge
VDS = –10 V,
ID = –8 A,
VGS = –4.5 V
5.6
7.8
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
–1.6
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = –1.6 A (Note 2)
–0.7
–1.2
V
trr
Reverse Recovery Time
27
ns
Qrr
Reverse Recovery Charge
IF = –8 A,
diF/dt = 100 A/µs
16
nC
Notes: 1.
R
θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. R
θJC is guaranteed by design while RθCA is determined by the user's board design.
a)
60°C/W when
mounted on a 1in
2 pad
of 2 oz copper
b)
111°C/W when mounted
on a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300
µs, Duty Cycle < 2.0%


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