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TPD2E001DRST-NM 데이터시트(PDF) 4 Page - Texas Instruments |
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TPD2E001DRST-NM 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 24 page 4 TPD2E001 SLLS684I – JULY 2006 – REVISED MARCH 2016 www.ti.com Product Folder Links: TPD2E001 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute-maximum-rating conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Power pin voltage –0.3 7 V VIO IO pin voltage –0.3 VCC + 0.3 V TJ Junction temperature 150 °C Bump temperature (soldering) Infrared (15 s) 220 °C Vapor phase (60 s) 215 Lead temperature (soldering, 10 s) 300 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±15000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000 6.3 ESD Ratings: Surge Protection VALUE UNIT V(ESD) Electrostatic discharge IEC 61000-4-2 contact ±8000 V IEC 61000-4-2 air-gap discharge ±15000 6.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT TA, operating free-air temperature –40 85 °C Operating voltage VCC pin 0.9 5.5 V IO1, IO2 pins 0 VCC (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Thermal Information THERMAL METRIC(1) TPD2E001 UNIT DRY (USON) DRL (SOT) DRS (WSON) DZD (SOP) 5 PINS 5 PINS 6 PINS 4 PINS RθJA Junction-to-ambient thermal resistance 374.2 257.6 91.9 213.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 223.4 97.6 106.9 93.5 °C/W RθJB Junction-to-board thermal resistance 227.8 74.2 64.8 56.8 °C/W ψJT Junction-to-top characterization parameter 52.9 7.5 10.2 4.2 °C/W ψJB Junction-to-board characterization parameter 224.8 73.7 64.9 56.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 87.5 N/A 29.9 N/A °C/W |
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