1

With exposed back side ground pad

BeRex’s Divider BD09B is designed for Cellu-

lar & GSM band with low Insertion Loss and

Isolation. This chip is fully passivated for en-

hanced performance and reliability and

packaged in RoHS-compliant with SOIC-8

surface mount package.

It can be used without back side ground sol-

dering. (This may degrade the performance

at the high frequency edge.)

Product Description

Device Features

 Base station Infrastructure

 Commercial/Industrial/Military wireless system

Applications

Evaluation Board Drawing

Typical Performance

1

Absolute Maximum Ratings

BeRex

●website: www.berex.com

●email: sales@berex.com

Specifications and information are subject to change and products may be discontinued without notice. BeRex is a trademark of BeRex.

All other trademarks are the property of their respective owners. © 2010 BeRex

Parameter

Min

Typical

Max

Unit

Frequency Range

700

1000

MHz

Insertion Loss

0.5

0.8

dB

Isolation

15

23

dB

IRL(S11)

-20

-15

dBm

ORL(S22/S33)

-23

-15

dBm

Amplitude Balance

0.05

0.2

dB

Phase Balance

0.2

0.5

deg

Parameter

Rating

Input Power

1W CW dBm

Storage Temperature

-55 to +155°C

Operating Temperature

-40 to +85°C

Operation of this device above any of these parameters may result in permanent damage.

Rev. D

*All specifications apply to the following test conditions,

1. Device performance _ measured on BeRex E/B at 25

°C, 50ohm system.

2. Insertion Loss: Above 3.0dB.

3. Back side ground _ soldered.

Function Block Diagram

Pins 1,3,4,6 and 7 must be DC and RF grounded.

Dedicated Band 2-Way SMT Power Divider

BD09B

700~1000MHz Cellular & GSM900